Heterogeneous Integration in the AI Era
April 24, 08:50 AM
Speaker: Subramani (Subi) Kengeri, Vice President, AI Systems Solutions
Speaker bio:
Subi Kengeri is the Vice President of AI Systems Solutions at Applied Materials. His team is chartered with the goal of architecting next generation AI Systems leveraging Applied’s fundamental innovations.
Prior to joining Applied, Subi was the CTO and vice president of world-wide client solutions at Globalfoundries, responsible for enabling differentiated SoC and systems solutions. Subi joined Globalfoundries in 2009 as the vice president of global design solutions responsible for world-wide design engineering and semiconductor eco-system development. He was responsible for determining technology feasibility, competitiveness, and manufacturability of technology platform through cross-functional collaboration of customers, R&D and eco-system. In the role of vice president of CMOS Platforms Business Unit, Subi was responsible for business results.
Subi started his SoC design engineering career at Texas Instruments in 1991 and prior to joining Globalfoundries, he was the senior director of design-technology platform and head of North America Design center, at TSMC. Subi has been granted 50+ U.S. design engineering patents and has given over 100 invited talks and press interviews.
The Future of Semiconductor Packaging and Heterogeneous Integration is Now
April 24, 10:00 AM
Speaker: Madhavan Swaminathan, The Pennsylvania State University, USA
Department Head of Electrical Engineering & William E. Leonhard Endowed Chair
Director of Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES) An SRC JUMP 2.0 Center
Abstract:
The global semiconductor industry is projected to become a trillion-dollar industry by 2030. This is historic considering that it took the industry 55 years to reach half a trillion dollars in size and will take just another 10 years to double in size to a trillion dollars. Advanced packaging is expected to play an important role in making this happen.
So, what are the key drivers, where are the challenges and what are the innovations necessary in advanced packaging over the next decade and beyond to be able to support heterogeneous integration? Why is semiconductor packaging becoming so important? These questions will be addressed in the context of emerging applications.
Speaker bio:
Madhavan Swaminathan is the Department Head of Electrical Engineering and is the William E. Leonhard Endowed Chair at Penn State University. He also serves as the Director for the Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES), an SRC JUMP 2.0 Center.
Prior to joining Penn State University, he was the John Pippin Chair in Microsystems Packaging & Electromagnetics in the School of Electrical and Computer Engineering (ECE), Professor in ECE with a joint appointment in the School of Materials Science and Engineering (MSE), and Director of the 3D Systems Packaging Research Center (PRC), Georgia Tech (GT). Prior to GT, he was with IBM working on packaging for supercomputers.
He is the author of 550+ refereed technical publications and holds 31 patents. He is the primary author and co-editor of 3 books and 5 book chapters, founder and co-founder of two start-up companies, and founder of the IEEE Conference on Electrical Design of Advanced Packaging and Systems (EDAPS), a premier conference sponsored by the IEEE Electronics Packaging Society (EPS). He is a Fellow of IEEE, Fellow of the National Academy of Inventors (NAI), and has served as the Distinguished Lecturer for the IEEE Electromagnetic Compatibility (EMC) society.
He received his MS and PhD degrees in Electrical Engineering from Syracuse University in 1989 and 1991, respectively.
The Heart of the Feedback Loop: MEMS Development and Test
April 25, 09:00 AM
Speaker: Lorie Burmood, Director of Operations, NXP Semiconductors
Speaker bio:
Lorie Burmood is Director of Operations for Motions Sensors, NXP Semiconductors in Chandler Arizona. Her team is responsible for product and test engineering development of next generation MEMS technologies.
Lorie has been with Motorola/Freescale/NXP since 1998. She joined Sensors in 2004 on the Tire Pressure Monitor System development team, leading the effort to create a media compatible solution for pressure sensors. In 2014 she was the Product Engineering Manager for all Motion Sensor NPI. As Director of Operations, she is now responsible for R&D Test Development, NPI Product Engineering as well as site selections for new products. She oversees the various manufacturing sites (fab, assembly, and test), enabling new product introductions into high volume manufacturing.
Lorie has a double B.S. from Case Western Reserve University in Chemical Engineering and Materials Science Engineering. In 2009, she received her M.S.E. degree from Arizona State University, with emphasis in Analog and Digital VLSI Design. She has received a Six Sigma Black Belt Certificate from GE Healthcare.