- J. Abraham – University of Texas at Austin
- M. Barragan – TIMA Laboratory
- B. Becker – Universität Freiburg
- R. Blanton – Carnegie Melon University
- A. Bosio – École Centrale de Lyon – INL
- K. Chakrabarty – Duke University
- T. Chakraborty – Qualcomm Inc.
- M. Chao – National Chiao Tung University
- D. Chen – Iowa State University
- H. Chen – Mediatek Inc.
- K. Chung – Qualcomm
- G. Di Natale – TIMA Laboratory / CNRS
- W. Dobbelaere – ON Semiconductor
- G. Fey – TU Hamburg
- P. Girard – LIRMM / CNRS
- D. Gizopoulos – University of Athens
- S. Gupta – University of Southern California
- G. Harutyunyan – Synopsis
- S. Hellebrand – University of Paderborn
- Y. Huang – Mentor, A Siemens Business
- M. Keim – Mentor, A Siemens Business
- E. Larsson – Lund University
- J.F. Li – National Central University
- W. Li – Intel
- T. M. Mak – Independent
- Y. Makris – UT Dallas
- H. Manhaeve – Ridgetop Europe
- P. Maxwell – ON Semiconductor
- S. Mir – TIMA Laboratory
- Z. Navabi – Worcester Polytechnic Institute
- A. Orailoglu – University of California, San Diego
- I. Pomeranz – Purdue University
- J. Rajski – Mentor, A Siemens Business
- S. Reddy – University of Iowa
- E. Sanchez – Politecnico di Torino
- S. Shoukourian – Synopsys
- O. Sinanoglu – NYU Abu Dhabi
- H. Stratigopoulos – Sorbonne University, CNRS, LIP6
- F. Su – Intel
- S. Sunter – Mentor, a Siemens Business
- M. Taouil – TU Delft
- M. Tehranipoor – University of Florida
- C. Thibeault – ETS Montreal
- L. C. Wang – University of California, Santa Barbara
- H.J. Wunderlich – University of Stuttgart