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Keynote Address
The Integration Train: Will Test Challenges Impede Progress

PRESENTERS: Ken Hansen (Vice President and Chief Technology Officer, Freescale Semiconductor, Inc.)

Biography: Ken Hansen is Vice President and Chief Technology Officer with Freescale Semiconductor. Prior to becoming CTO, Ken was Vice President and led Freescale’s Chief Development Office where he improved design efficiency and reduced product cost for all Freescale business units. Previously, he held several senior technology and management positions at Freescale and Motorola leading research and development teams. He received his BSEE and MSEE from the University of Illinois, has been recognized as an ECE Distinguished Alumni, is a Fellow of the IEEE, and holds 11 U.S. patents. Ken is an industry veteran, with 36 years of analog and digital design experience in bipolar, CMOS, and BiCMOS technologies primarily in the area of wireless communications.

Invited Keynote
Are the Test Solutions Ready to take up the Challenges posed by Advanced Technology R&D?

PRESENTERS: Subramani Kengeri (Vice President of Advanced Technology Architecture, GLOBALFOUNDRIES)

Abstract: The cost of building a new advanced fab has reached $6B. Process development and chip design costs are going up astronomically, while the product life is getting shorter. Advanced technologies at 14nm and beyond are getting immensely complex and introduce many new failure mechanisms. This keynote will review the technical and business challenges that are driving the need for early development of new fault models and cost effective test solutions for next generation products.

Biography: Subramani is responsible for defining competitive process architecture on advanced nodes in support of “first time right” technology development. He is responsible for determining the technology feasibility, competitiveness and manufacturability of all elements of technology platform and to establish the advanced technology roadmap for GLOBALFOUNDRIES. Subramani joined GLOBALFOUNDRIES in 2009 as the Vice President of Design Solutions. He implemented strategic Design enablement initiatives and established a strong foundation for collaboration with Design eco-system, before moving to focus on R&D. He started his Semiconductor career at Texas Instruments and prior to joining GLOBALFOUNDRIES, he was the Senior Director of Design and Technology Platform at TSMC. Subramani holds a master’s degree in electrical engineering from Indian Institute of Technology (IIT, Delhi) and has been granted 30+ U.S. patents.
 
DEADLINES
  • Hotel Cut-Off: Apr. 7th
  • Reg. Cut-Off: Apr. 19th
  • CameraReady: Feb. 8th '13
  • PhD Cont.: Feb. 15th '13
  • Abstract: Oct. 18th '13
  • Final PDF: Oct. th '13 Oct. 25th '13 (Extended)
  • Notif.: Dec. 20th '13


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