Keynotes

Monday April 28, 2025

10:30AM-11:30AM

Dr. Dev Shenoy

Principal Director for Microelectronics

Office of the Under Secretary of Defense for Research and Engineering

US Department of Defense

Biography:

Dr. Dev Shenoy joined the Office of the Under Secretary of Defense for Research and Engineering, OUSD(R&E), as the Principal Director for Microelectronics in July 2021. In this role, Dr. Shenoy is responsible for leading the Department of Defense’s research and engineering efforts in microelectronics. He has provided numerous keynote addresses, participated in multiple discussion panels, and given interviews across a broad range of industry, academic, interagency, and defense communities.

Prior to joining OUSD(R&E), Dr. Shenoy served as the Director of Microelectronics Innovation and as Director of Advanced Technologies at the University of Southern California’s Information Sciences Institute (USC/ISI).

Prior to joining USC/ISI, Dr. Shenoy served as Chief Engineer in the Advanced Manufacturing Office at the Department of Energy (DoE). In that role, he co-authored DoE’s 2015 Quadrennial Technology Review that served as a blueprint for DoE’s energy technology investments. Among other initiatives, Dr. Shenoy proposed and led a “Big Idea” for U.S. national security and economic competitiveness within the Office of Energy Efficiency and Renewable Energy on “Beyond Moore Computing” with participation from eight DoE national labs.

Prior to joining DoE, Dr. Shenoy served as a Senior Advisor at the Manufacturing and Industrial Base Policy (MIBP) Office within the Office of the Secretary of Defense (OSD) as a detailee from the Army Night Vision and Sensors Directorate at Fort Belvoir. In that role, he co-led a telecom initiative with the White House Office of Science and Technology Policy to explore U.S. opportunities in optical networks. While at OSD/MIBP, Dr. Shenoy proposed and helped develop a public-private partnership in photonics that led to the creation of the AIM Photonics Institute.

Prior to serving at OSD/MIBP, Dr. Shenoy was a program manager at the Defense Advanced Research Projects Agency where he developed and managed cutting-edge technology programs in the areas of spintronics, such as the Spin Torque Transfer Random Access Memory program, a technology that was successfully transitioned and commercialized. Dr. Shenoy also developed and led programs in photonics and micro-electromechanical systems or defense and commercial applications.

Dr. Shenoy has a Ph.D. in physics from the prestigious Indian Institute of Science in Bangalore, India, and National Science Foundation post-doctoral experience from Case Western Reserve University in Cleveland, Ohio.

Tuesday, April 29, 2025

8:30AM-9:30AM

 

Anne Matsuura

Sr. Principal Engr

Intel Labs

Wednesday, April 30

9AM-10AM

Eric Makara

Microelectronics Commons 5G/6G Lead

Naval Research Laboratory

Biography:

Eric Makara is the Section Head of the Systems Integration & Instrumentation Section, within the Networks and Communication Systems Branch, of the U.S. Naval Research Laboratory (NRL) in Washington, DC. In his position, Mr. Makara leads a team of researchers specializing in wireless communications systems and networks. He has led and contributed to projects in spectrum sharing, dynamic spectrum management, software defined radio, waveforms for air combat training, tactical wireless communications, 5G technologies, multifunction communications systems integration, and wireless network modeling and emulation.

Mr. Makara is the 5G/6G Technical Execution Area Lead for the DoD Microelectronics Commons program, supporting the Office of the Under Secretary of Defense for Research & Engineering (OUSD(R&E)). In this role, Mr. Makara is responsible for technical oversight, management, and strategy of the 5G/6G technologies portfolio. The Microelectronics Commons is a national network of prototyping innovation hubs that are creating direct pathways to commercialization for US microelectronics from “lab to fab”. Microelectronics Commons supports six critical technology areas, including 5G/6G technologies, Artificial Intelligence (AI) Hardware, Commercial Leap-Ahead technologies, Electromagnetic Warfare (EW), Secure Edge / Internet of Things (IoT) Computing, and Quantum.

1:30PM-2:30PM

Dr. Bill Lambert

Fellow, AMD

Biography:

William Lambert is a Fellow of AMD, Inc. where he leads a team defining the packaging solutions for next-generation products including datacenter GPUs and CPUs, client GPUs and CPUs, and more. Prior to joining AMD, he was a Senior Principal Engineer in the Assembly & Test Technology Development group at Intel Corporation, where he held leadership roles in packaging architecture definition, power delivery and integrated voltage regulation technology development, and RF packaging development. He received his Ph.D. in electrical engineering from Arizona State University with a focus on low-voltage DC-DC power electronics for computer systems, and his M.S. and B.S. degrees from Rochester Institute of Technology.